Meeting Ever-Increasing Thermal Demands
Today’s electronics are smaller and more powerful than ever, leading to ever increasing thermal challenges for the systems designer. While fans, heat sinks, and even liquid cooling and thermoelectric devices can be used to provide enough cooling power, the problem remains to get the heat from the hot components into the cooling hardware. Thermal Interface Materials (TIMs) are designed to fill in air gaps and microscopic irregularities, resulting in dramatically lower thermal resistance and thus better cooling. Laird Technologies is the world leader in material development for TIMs, and offers the broadest line of products to meet every design challenge.
With gap filler pads as thick as 5 mm, as well as electrically insulating and electrically conductive pads, we can solve any TIM design problem. In addition, Laird Technologies provides phase change TIMs which soften and fill tiny gaps at operating temperature, as well as thermally conductive greases which conform to any irregularity.
Laird Technologies’ TIMs offer operating temperatures up to 200°C, thermal conductivities over 5 W/m-K in the Z axis, and tremendous flexibility in form factor and packaging, including die-cut parts on tape and other solutions to support any manufacturing scenario.
Contact Laird Technologies today for your complete application solutions.